PIC17C7XX Datasheet, PDF (277/328 Pages) Microchip Technology – High-Performance 8-Bit CMOS EPROM Microcontrollers with 10-bit A/D

22.0 PACKAGING INFORMATION
Package Type: K04-085 64-Lead Plastic Thin Quad Flatpack (PT)
10x10x1 mm Body, 1.0/0.1 mm Lead Form
E1
E
# leads = n1
p
PIC17C7XX
D D1
2
1
B
n
X x 45°
L
A
α
R2
c
R1
φ
A1
β
L1
A2
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
p
0.020
0.50
Number of Pins
n
64
64
Pins along Width
n1
16
16
Overall Pack. Height
A
0.039
0.043
0.047
1.00
1.10
1.20
Shoulder Height
A1
0.015
0.025
0.035
0.38
0.64
0.89
Standoff
A2
0.002
0.004
0.006
0.05
0.10
0.15
Shoulder Radius
R1
0.003
0.003
0.010
0.08
0.08
0.25
Gull Wing Radius
R2
0.003
0.006
0.008
0.08
0.14
0.20
Foot Length
L
0.005
0.012
0.015
0.13
0.30
0.38
Foot Angle
φ
0
3.5
7
0
3.5
7
Radius Centerline
L1
0.003
0.008
0.013
0.08
0.20
0.33
Lead Thickness
Lower Lead Width
c
0.004
0.006
0.008
0.09
0.15
0.20
B^†
0.007
0.009
0.011
0.17
0.22
0.27
Outside Tip Length
D1
0.463
0.472
0.482
11.75
12.00
12.25
Outside Tip Width
E1
Molded Pack. Length
D^‡
Molded Pack. Width
E^‡
0.463
0.390
0.390
0.472
0.394
0.394
0.482
0.398
0.398
11.75
9.90
9.90
12.00
10.00
10.00
12.25
10.10
10.10
Pin 1 Corner Chamfer
X
0.025
0.035
0.045
0.64
0.89
1.14
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom β
5
12
15
5
12
15
* _{Controlling Parameter.}
† _{Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”}
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ _{Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not}
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
© 1998 Microchip Technology Inc.
DS30289A-page 277