MRF24J40_08 Datasheet, PDF (142/152 Pages) Microchip Technology – IEEE 802.15.4™ 2.4 GHz RF Transceiver

MRF24J40
6.2 Package Details
The following sections give the technical details of the
packages.
40-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6x0.9 mm Body [QFN]
with 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D2
EXPOSED PAD
E
E2
2
1
N
TOP VIEW
NOTE 1
2
1
N
L
BOTTOM VIEW
e
b
K
A
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Pins
N
40
Pitch
e
0.50 BSC
Overall Height
A
0.80
0.90
Standoff
A1
0.00
0.02
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
4.50
4.65
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
4.50
4.65
Contact Width
b
0.18
0.25
Contact Length
L
0.30
0.40
Notes:
Contact-to-Exposed Pad
K
0.20
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
MAX
1.00
0.05
4.80
4.80
0.30
0.50
–
Microchip Technology Drawing C04-118C
DS39776B-page 140
Preliminary
© 2008 Microchip Technology Inc.