MC68HC705J2 Datasheet, PDF (80/82 Pages) Freescale Semiconductor, Inc – member of the low-cost

Freescale Semiconductor, Inc.
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12.3 Ceramic DIP (Cerdip)
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A
F
H
D
SEATING
PLANE
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B
C
N
K
G
L
J
M
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
INCHES
DIM MIN MAX
A 0.940 0.990
B 0.260 0.295
C 0.150 0.200
D 0.015 0.022
F 0.055 0.065
G 0.100 BSC
H 0.020 0.050
J 0.008 0.012
K 0.125 0.160
L 0.300 BSC
M
0_ 15_
N 0.010 0.040
Figure 12-3. MC68HC705J2S (Case 732-03)
12-4
MECHANICAL SPECIFICATIONS
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Rev. 2