MC68HC705J2 Datasheet, PDF (77/82 Pages) Freescale Semiconductor, Inc – member of the low-cost

Freescale Semiconductor, Inc.
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SECTION 12
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MECHANICAL SPECIFICATIONS
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The MC68HC705J2 is available in the following packages:
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• 738-03 — plastic dual in-line package (PDIP)
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• 751D-04 — small outline integrated circuit (SOIC)
• 732-03 — ceramic DIP (Cerdip) (windowed)
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The following figures show the latest packages at the time of this publication. To make sure
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that you have the latest package specifications, contact one of the following:
• Local Motorola Sales Office
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• Motorola Mfax
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– Phone [phone]
– EMAIL [e-mail]
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• Worldwide Web (wwweb) at http://design-net.com
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Follow Mfax or Worldwide Web on-line instructions to retrieve the current mechanical
specifications.
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Rev. 2
MECHANICAL SPECIFICATIONS
For More Information On This Product,
Go to: www.freescale.com
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