MC68340FE16E Datasheet, PDF (431/441 Pages) Freescale Semiconductor, Inc – Integrated Processor with DMA User’s Manual

Freescale Semiconductor, Inc.
12.3 PACKAGE DIMENSIONS
12.3.1 FE Suffix
FE SUFFIX PACKAG
CERAMIC QFP
CASE 863A-01
X
PIN ONE INDEN
TOP VIEW
TRIMMED, FORMED DISCRET
SHOWING DATUM FEATUR
Z
R
Q
0.50M T X Y S Z S
Y
CJ
W
H
D144X
G
0.20M T X-Y Z S
0.20M T Z S X-Y S
S/V
SIDE VIEW
GULL WING LEAD CONFIGURA
K
M
M
∩ 0.10144X
T SEATING PLANE
0.20 T X-Y Z S
0.20S T Z S X-Y S
MILLIMETE
DIM MIN MAX
A 25.84 27.70
B 25.84 27.70
C 3.55 4.31
D 0.22 0.41
G 0.65 BS
H 0.25 0.88
J 0.13 0.25
K 0.65 0.95
M 0^°
8°
Q 0.325 BS
INCHE
MIN MAX
1.017 1.09
1.017 1.09
0.140 0.170
0.009 0.016
0.0256 BS
0.010 0.035
0.005 0.010
0.026 0.037
0°
8°
0.0128 BS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIM A AND B DEFINE MAXIMUM CERAMIC BODY DIMEN
INCLUDING GLASS PROTRUSION AND MISMATCH OF CE
BODY TOP AND BOTTOM.
4. DATUM PLANE -W- IS LOCATED AT THE UNDERSIDE O
WHERE LEADS EXIT PACKAGE BODY.
5. DATUMS X-Y AND Z TO BE DETERMINED WHERE CENT
EXIT PACKAGE BODY AT DATUM -W-.
6. DIM S AND V TO BE DETERMINED AT SEATING PLANE
7. DIM A AND B TO BE DETERMINED AT DATUM PLANE -
12-6
MC68340 USER’S MANUAL
MOTOROLA
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