MC68HC908LJ12 Datasheet, PDF (408/413 Pages) Freescale Semiconductor, Inc – 8-bit microcontroller units

Mechanical Specifications
24.4 64-Pin Low-Profile Quad Flat Pack (LQFP)
4X
0.2 H A–B D
64
1
4X 16 TIPS
0.2 C A–B D
49
48
A
B
3X
VIEW Y
E1 E
A1
E1/2
E/2
16
17
33
32
D
D1/2
D/2
D1
D
HA
C
SEATING
PLANE
4X (θ 2)
4X (θ 3)
0.08 C
VIEW AA
X
X=A, B OR D
CL
AB
AB
VIEW Y
e/2
60X e
BASE METAL
b1
c
c1
PLATING
b
0.08 M C A–B D
SECTION AB–AB
ROTATED 90° CLOCKWISE
A2
0.05 S
(S)
2X R R1
θ1
0.25
θ
GAGE PLANE
(L2)
L
(L)
VIEW AA
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE DATUM H IS LOCATED AT
BOTTOM OF LEAD AND IS COINCIDENT WITH
THE LEAD WHERE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
4. DATUMS A, B AND D TO BE DETERMINED AT
DATUM PLANE DATUM C.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE DATUM C.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.25 PER SIDE.
7. DIMENSION bDOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE b DIMENSION TO EXCEED 0.35.
MINIMUM SPACE BETWEEN PROTRUSION AND
ADJACENT LEAD OR PROTRUSION 0.07.
MILLIMETERS
DIM MIN MAX
A — 1.60
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D 12.00 BSC
D1 10.00 BSC
e
0.50 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.75
L1
1.00 REF
L2
0.50 REF
R1 0.10 0.20
S
0.20 REF
θ
0°
7°
θ 1 0°
—
θ2
12 REF
θ3
12 REF
Figure 24-2. 64-Pin Low-Profile Quad Flat Pack (Case No. 840F)
MC68HC908LJ12 — Rev. 2.1
Freescale Semiconductor
Mechanical Specifications
Technical Data
409