BCM4354KKWBGT Datasheet, PDF (185/192 Pages) Cypress Semiconductor – Single-Chip 5G Wi-Fi IEEE 802.11ac 2×2 MAC/ Baseband/Radio with Integrated Bluetooth 4.1 and FM Receiver

BCM4354 Data Sheet
Package Information
Section 22: Package Information
Package Thermal Characteristics
The information in Table 62 and Table 63 is based on the following conditions:
• No heat sink, T_A = 70°C. This is an estimate, based on a 4-layer PCB that conforms to EIA/JESD51–7
(101.6 mm × 101.6 mm × 1.6 mm) and P = 1.53W continuous dissipation.
• Absolute junction temperature limits are maintained through active thermal monitoring and driver-based
techniques that may include duty-cycle limiting or turning off one of the TX chains, or both.
Table 62: WLCSP Package Thermal Characteristics
Characteristic
θ_JA (°C/W) (value in still air)
θ_JB (°C/W)
θ_JC (°C/W)
_JT (°C/W)
_JB (°C/W)
Maximum Junction Temperature T_j (°C)
Maximum Power Dissipation (W)
WLCSP
26.86
2.23
1.09
2.48
11.61
125
1.53
Table 63: WLBGA Package Thermal Characteristics
Characteristic
θ_JA (°C/W) (value in still air)
θ_JB (°C/W)
θ_JC (°C/W)
_JT (°C/W)
_JB (°C/W)
Maximum Junction Temperature T_j (°C)
Maximum Power Dissipation (W)
WLBGA
26.80
1.66
1.16
1.85
7.93
125
1.53
Broadcom^®
October 15, 2014 • 4354-DS109-R
BROADCOM CONFIDENTIAL
Page 184