W83791G Datasheet, PDF (93/99 Pages) Winbond – Winbond H/W Monitoring IC

W83791D/G
11. PACKAGE SPECIFICATION
(48-pin LQFP)
HD
D
36
25
37
24
E HE
48
13
1
e
b ¹²
Seating Plane
See Detail F
A2 A
A1
y
c
L
L1
Detail F
Symbol
A
A1
A2
b
c
D
E
e
HD
HE
L
L1
y
0
Dimension in inch
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
---
---
1.60
0.05 ---
0.15
1.35 1.40 1.45
0.17 0.20 0.27
0.09 ---
0.20
7.00
7.00
0.50
9.00
9.00
0.45 0.60 0.75
1.00
--- 0.08
---
0
3.5
7
Notes:
1. Dimensions D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based
on final visual inspection spec.
- 87 -
Publication Release Date: April 14, 2006
Revision 1.1