W83791G Datasheet, PDF (6/99 Pages) Winbond – Winbond H/W Monitoring IC

W83791D/G
7.86 Speech Flash Memory Read Data Registers ⎯ Index A4h-A5h (Bank 0) ........................ 64
7.87 EVNTRAP1- 5 and GPIO 5-9 Select ⎯ Index A6h (Bank 0)............................................. 64
7.88 Flash Page count ⎯ Index A7h (Bank 0) .......................................................................... 65
7.89 Real Time Hardware Status Register I ⎯ Index A9h (Bank 0).......................................... 65
7.90 Real Time Hardware Status Register II ⎯ Index AAh (Bank 0) ........................................ 65
7.91 Real Time Hardware Status Register III ⎯ Index ABh (Bank 0) ....................................... 66
7.92 Revered ⎯ Index AC - AFh (Bank 0) ................................................................................ 67
7.93 Value RAM 2⎯ Index B0h – B7h (BANK 0) ...................................................................... 67
7.94 Temperature Sensor 2 Temperature (High Byte) Register ⎯ Index C0h (Bank 0)........... 67
7.95 Temperature Sensor 2 Temperature (Low Byte) Register ⎯ Index C1h (Bank 0)............ 67
7.96 Temperature Sensor 2 Configuration Register ⎯ Index C2h (Bank 0) ............................. 68
7.97 Temperature Sensor 2 Hysteresis (High Byte) Register ⎯ Index C3h (Bank 0)............... 68
7.98 Temperature Sensor 2 Hysteresis (Low Byte) Register ⎯ Index C4h (Bank 0) ............... 68
7.99 Temperature Sensor 2 Over-temperature (High Byte) Register ⎯ Index C5h (Bank 0)... 68
7.100 Temperature Sensor 2 Over-temperature (Low Byte) Register ⎯ Index C6h (Bank 0).... 68
7.101 Temperature Sensor 3 Temperature (High Byte) Register ⎯ Index C8h (Bank 0)........... 69
7.102 Temperature Sensor 3 Temperature (Low Byte) Register ⎯ Index C9h (Bank 0)............ 69
7.103 Temperature Sensor 3 Configuration Register ⎯ Index CAh (Bank 0)............................. 69
7.104 Temperature Sensor 3 Hysteresis (High Byte) Register ⎯ Index CBh (Bank 0) .............. 69
7.105 Temperature Sensor 3 Hysteresis (Low Byte) Register ⎯ Index CCh (Bank 0)............... 69
7.106 Temperature Sensor 3 Over-temperature (High Byte) Register ⎯ Index CDh (Bank 0) .. 70
7.107 Temperature Sensor 3 Over-temperature (Low Byte) Register ⎯ Index CEh (Bank 0) ... 70
8. ARP (ADDRESS RESOLUTION PROTOCOL) USE REGISTER DEFINED.............................. 71
8.1 Unique Device Identifier (UDID) -- 20h-2Fh (Bank 1)........................................................ 71
8.2 ASF Sensor Environmental Event ..................................................................................... 72
8.2.1 Temperature: Get Event Data message .............................................................................72
8.2.2 Voltage: Get Event Data message .....................................................................................75
8.2.3 Fan: Get Event Data message ...........................................................................................77
8.2.4 Case Intrusion: Get Event Data message ..........................................................................79
8.3 ASF Response Registers ⎯ Index 40h-7Fh (Bank 1)...................................................... 80
8.3.1 ASF Upper/Lower Temperature Registers: ........................................................................80
8.3.2 Sensor device: (SMBus Address, Read/Write)...................................................................81
8.3.3 Relative Entity ID Table: .....................................................................................................81
8.3.4 Entity Instance Register......................................................................................................82
8.4 BJT RT-Table - 50h-57h (Bank 7) ⎯ TEST mode only..................................................... 82
9. ELECTRICAL CHARACTERISTICS ........................................................................................... 83
9.1 Absolute Maximum Ratings ............................................................................................... 83
9.2 DC Characteristics ............................................................................................................. 83
9.3 AC Characteristics ............................................................................................................. 85
9.3.1 Serial Bus Timing Diagram.................................................................................................85
10. HOW TO READ THE TOP MARKING ........................................................................................ 86
11. PACKAGE SPECIFICATION....................................................................................................... 87
Publication Release Date: April 14, 2006
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Revision 1.1