W83791G Datasheet, PDF (87/99 Pages) Winbond – Winbond H/W Monitoring IC

W83791D/G
8.3.2 Sensor device: (SMBus Address, Read/Write)
INDEX
DESCRIPTION
4Fh
Sensor Device SMBus Address assigned by ARP
DEFAULT VALUE
00h
8.3.3 Relative Entity ID Table:
INDEX
50h
51h
52h
53h
54h
55h
56h
57h
MONITOR ITEM
VIN0 (VCORE)
VIN1 (VINR0)
VIN2 (+3.3VIN)
VIN3 (+5 VIN)
VIN4 (+12VIN)
VIN5 (-12VIN)
VIN6 (-5VIN)
VSB
DEFAULT ENTITY ID
3 (CPU)
7 (System Board)
7 (System Board)
7 (System Board)
7 (System Board)
7 (System Board)
7 (System Board)
7 (System Board)
58h
VBAT
7 (System Board)
59h
VINR1
3 (CPU)
5Ah
FAN1
7 (System Board)
5Bh
FAN2
3 (CPU)
5Ch
FAN3
3 (CPU)
5Dh
5Eh
5Fh
60h
61h-6Fh
Temperature 1
Temperature 2
Temperature 3
Chassis Intrusion
Reserved
7 (System Board)
3 (CPU)
3 (CPU)
23 (System Chassis)
Reserved
Table of Entity ID defined in PET 1.0 or IPMI 1.0
ENTITY DEFINITION
CPU
3
System
7
Memory module
8
System Chassis
23
Fan/Cooling device
29
Memory device
32
ENTITY ID
- 81 -
Publication Release Date: April 14, 2006
Revision 1.1