W29N02GVSIAA Datasheet, PDF (8/79 Pages) Winbond – W29N02GV 2G-BIT 3.3V NAND FLASH MEMORY

W29N02GV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W29N02GV is offered in a 48-pin TSOP1 package (Code S) and 63-ball VFBGA package (Code B)
as shown in Figure 3-1 to 3-3, respectively. Package diagrams and dimensions are illustrated in
Section: Package Dimensions.
3.1 Pin assignment 48-pin TSOP1(x8)
X8
N.C
1
N.C
2
N.C
3
N.C
4
N.C
5
N.C
6
RY/#BY
7
#RE
8
#CE
9
N.C
10
N.C
11
Vcc
12
Vss
13
N.C
14
N.C
15
CLE
16
ALE
17
#WE 18
#WP ₁₉
DNU ₂₀
N.C
21
N.C
22
N.C
23
N.C
24
Top View
48-pin TSOP1
Standard package
12mm x 20mm
X8
48
Vss¹
47
N.C
46
N.C
45
N.C
44
IO7
43
IO6
42
IO5
41
IO4
40
N.C
39
Vcc¹
38 DNU
37
Vcc
36
Vss
35
N.C
34
Vcc¹
33
N.C
32
IO3
31
IO2
30
IO1
29
IO0
28
N.C
27
N.C
26
N.C
25
Vss¹
Figure 3-1 Pin Assignment 48-pin TSOP1 (Package code S)
Note:
1.
These pins might not be connected in the package. Winbond recommends connecting these pins to the
designed external sources for ONFI compatibility.
Release Date: February 1^st, 2016
8
– Revision B