MSP430FR2033 Datasheet, PDF (72/89 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430FR2033, MSP430FR2032
SLASE45B – OCTOBER 2014 – REVISED AUGUST 2015
www.ti.com
7.1.6 General Layout Recommendations
• Proper grounding and short traces for external crystal to reduce parasitic capacitance. See the
application report MSP430 32-kHz Crystal Oscillators (SLAA322) for recommended layout guidelines.
• Proper bypass capacitors on DVCC and reference pins, if used.
• Avoid routing any high-frequency signal close to an analog signal line. For example, keep digital
switching signals such as PWM or JTAG signals away from the oscillator circuit.
• Refer to the Circuit Board Layout Techniques design guide (SLOA089) for a detailed discussion of
PCB layout considerations. This document is written primarily about op amps, but the guidelines are
generally applicable for all mixed-signal applications.
• Proper ESD level protection should be considered to protect the device from unintended high-voltage
electrostatic discharge. See the application report MSP430 System-Level ESD Considerations
(SLAA530) for guidelines.
7.1.7 Do's and Don'ts
During power up, power down, and device operation, DVCC must not exceed the limits specified in
Section 5.1, Absolute Maximum Ratings. Exceeding the specified limits may cause malfunction of the
device including erroneous writes to RAM and FRAM.
7.2 Peripheral- and Interface-Specific Design Information
7.2.1 ADC Peripheral
7.2.1.1 Partial Schematic
Using an
External
Positive
Reference
Using an
External
Negative
Reference
+
10 µF 100 nF
+
10 µF 100 nF
DVSS
VREF+/VEREF+
VEREF-
Figure 7-5. ADC Grounding and Noise Considerations
7.2.1.2 Design Requirements
As with any high-resolution ADC, appropriate printed-circuit-board layout and grounding techniques should
be followed to eliminate ground loops, unwanted parasitic effects, and noise.
Ground loops are formed when return current from the ADC flows through paths that are common with
other analog or digital circuitry. If care is not taken, this current can generate small unwanted offset
voltages that can add to or subtract from the reference or input voltages of the ADC. The general
guidelines in Section 7.1.1 combined with the connections shown in Section 7.2.1.1 prevent this.
In addition to grounding, ripple and noise spikes on the power-supply lines that are caused by digital
switching or switching power supplies can corrupt the conversion result. TI recommends a noise-free
design using separate analog and digital ground planes with a single-point connection to achieve high
accuracy.
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Applications, Implementation, and Layout
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