MSP430FR2033 Datasheet, PDF (17/89 Pages) Texas Instruments – Mixed-Signal Microcontrollers

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MSP430FR2033, MSP430FR2032
SLASE45B – OCTOBER 2014 – REVISED AUGUST 2015
5.10 Typical Characteristics - Current Consumption Per Module
MODULE
Timer_A
eUSCI_A
eUSCI_A
eUSCI_B
eUSCI_B
RTC
CRC
TEST CONDITIONS
UART mode
SPI mode
SPI mode
I²C mode, 100 kbaud
From start to end of operation
REFERENCE CLOCK
Module input clock
Module input clock
Module input clock
Module input clock
Module input clock
32 kHz
MCLK
TYP
UNIT
5
µA/MHz
7
µA/MHz
5
µA/MHz
5
µA/MHz
5
µA/MHz
85
nA
8.5
µA/MHz
5.11 Thermal Characteristics
PARAMETERS
VALUE
UNIT
θ_JA
θ_{JC, (TOP)}
θ_JB
Junction-to-ambient thermal resistance, still air⁽¹⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance⁽³⁾
LQFP-64 (PM)
61.7
°C/W
25.4
°C/W
32.7
°C/W
Ψ_JB
Junction-to-board thermal characterization parameter
32.4
°C/W
Ψ_JT
θ_JA
θ_{JC, (TOP)}
θ_JB
Junction-to-top thermal characterization parameter
Junction-to-ambient thermal resistance, still air(⁽¹⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance⁽³⁾
TSSOP-56 (DGG56)
2.5
°C/W
62.4
°C/W
18.7
°C/W
31.4
°C/W
Ψ_JB
Junction-to-board thermal characterization parameter
31.1
°C/W
Ψ_JT
θ_JA
θ_{JC, (TOP)}
θ_JB
Junction-to-top thermal characterization parameter
Junction-to-ambient thermal resistance, still air(⁽¹⁾
Junction-to-case (top) thermal resistance⁽²⁾
Junction-to-board thermal resistance⁽³⁾
TSSOP-48 (DGG48)
0.8
°C/W
68.9
°C.W
23
°C/W
35.8
°C/W
Ψ_JB
Junction-to-board thermal characterization parameter
35.3
°C/W
Ψ_JT
Junction-to-top thermal characterization parameter
1.1
°C/W
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold place test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold place fixture to control the PCB
temperature, as described in JESD51-8.
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Specifications
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