CC2510FX Datasheet, PDF (237/244 Pages) List of Unclassifed Manufacturers – True System-on-Chip with Low Power RF Transceiver and 8051 MCU

18.1 Recommended PCB Layout for Package (QLP 36)
C2510Fx / CC2511Fx
Figure 61: Recommended PCB Layout for QLP 36 Package
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2510EM
reference design [1] and theCC2511 USB-Dongle reference design [2].
Thermal Resistance
Air velocity [m/s] 0
Rth,j-a [C/W]
32
Table 75: Thermal Properties of QLP 36 Package
18.2 Soldering information
The recommendations for lead-free reflow in
IPC/JEDEC J-STD-020D should be followed.
The lead finish is annealed (150 °C for 1 hr)
pure matte tin.
18.3 Tray Specification
Tray Specification
Package Tray Length
QLP 36 322.6 mm
Tray Width Tray Height
135.9 mm 7.62 mm
Units per Tray
490
Table 76: Tray Specification
SWRS055D
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