LSM6DB0 Datasheet, PDF (64/66 Pages) STMicroelectronics – 3D accelerometer, 3D gyroscope and signal processor

Package information
13 Package information
LSM6DB0
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 20. LGA-22: mechanical data and package dimensions
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.1mm unless otherwise specified
ITEM
Length [L]
Width [W]
Height [H]
OUTER DIMENSIONS
DIMENSION [mm]
3.00
3.00
1.03
TOLERANCE [mm]
± 0.1
± 0.1
MAX
8514415_A
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