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| LSM6DB0 Datasheet, PDF (63/66 Pages) STMicroelectronics – 3D accelerometer, 3D gyroscope and signal processor | |||
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LSM6DB0
12 Soldering information
Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and âGreenâ standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave âPin 1 Indicatorâ unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
DocID025603 Rev 1
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