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K4J55323QG Datasheet, PDF (3/53 Pages) Samsung semiconductor – 256Mbit GDDR3 SDRAM | |||
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K4J55323QG
256M GDDR3 SDRAM
2M x 32Bit x 4 Banks Graphic Double Data Rate 3 Synchronous DRAM
with Uni-directional Data Strobe
1.0 FEATURES
⢠1.8V + 0.1V power supply for device operation
⢠1.8V + 0.1V power supply for I/O interface
⢠On-Die Termination (ODT)
⢠Output Driver Strength adjustment by EMRS
⢠Calibrated output drive
⢠1.8V Pseudo Open drain compatible inputs/outputs
⢠4 internal banks for concurrent operation
⢠Differential clock inputs (CK and CK)
⢠Commands entered on each positive CK edge
⢠CAS latency : 4, 5, 6, 7, 8, 9, 10, 11 (clock)
⢠Additive latency (AL): 0 and 1 (clock)
⢠Programmable Burst length : 4 and 8
⢠Programmable Write latency : 1, 2, 3, 4, 5, 6 and 7 (clock)
⢠Single ended READ strobe (RDQS) per byte
⢠Single ended WRITE strobe (WDQS) per byte
⢠RDQS edge-aligned with data for READs
⢠WDQS center-aligned with data for WRITEs
⢠Data Mask(DM) for masking WRITE data
⢠Auto & Self refresh modes
⢠Auto Precharge option
⢠32ms, auto refresh (4K cycle)
⢠136 Ball FBGA
⢠Maximum clock frequency up to 800MHz
⢠Maximum data rate up to 1.6Gbps/pin
⢠DLL for outputs
⢠Boundary scan function with SEN pin
⢠Mirror function with MF pin
2.0 ORDERING INFORMATION
Part Number
Max Freq.
K4J55323QG-BC12
800MHz
K4J55323QG-BC14
700MHz
K4J55323QG-BC16
600MHz
K4J55323QG-BC20
500MHz
K4J55323QC-AC** is leaded package part number
Max Data Rate
1.6Gbps/pin
1.4Gbps/pin
1.2Gbps/pin
1.0Gbps/pin
Interface
Pseudo
Open Drain_18
Package
136 Ball FBGA
3.0 GENERAL DESCRIPTION
FOR 2M x 32Bit x 4 Bank GDDR3 SDRAM
The K4J55323QG is 268,435,456 bits of hyper synchronous data rate Dynamic RAM organized as 4 x 2,097,152 words by 32 bits, fab-
ricated with SAMSUNGâs high performance CMOS technology. Synchronous features with Data Strobe allow extremely high perfor-
mance up to 6.4GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of operating frequencies, and
programmable latencies allow the device to be useful for a variety of high performance memory system applications.
3 of 53
Rev. 1.1 November 2005
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