MC68HC908JL3E Datasheet, PDF (213/226 Pages) Motorola, Inc – Microcontrollers

19.5 28-Pin PDIP
28
1
A
HG
F
Mechanical Specifications
28-Pin PDIP
15
B
14
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 36.45 37.21
B 13.72 14.22
C 3.94 5.08
D 0.36 0.56
F 1.02 1.52
G
2.54 BSC
H 1.65 2.16
J 0.20 0.38
K 2.92 3.43
L
15.24 BSC
M
0° 15°
N 0.51 1.02
INCHES
MIN MAX
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0° 15°
0.020 0.040
Figure 19-3. 28-Pin PDIP (Case #710)
19.6 28-Pin SOIC
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
28
15
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
14X P
-B-
0.010 (0.25) M B M
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
1
14
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
28X D
AT MAXIMUM MATERIAL CONDITION.
0.010 (0.25) M T A S B S
M
R X 45
MILLIMETERS
DIM MIN MAX
A 17.80 18.05
INCHES
MIN MAX
0.701 0.711
B 7.40 7.60 0.292 0.299
C
C 2.35 2.65 0.093 0.104
26X G
-T-
SEATING
PLANE
K
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G
1.27 BSC
0.050 BSC
J 0.23 0.32 0.009 0.013
F
K 0.13 0.29 0.005 0.011
M 0°
8°
0°
8°
P 10.01 10.55 0.395 0.415
J
R 0.25 0.75 0.010 0.029
Figure 19-4. 28-Pin SOIC (Case #751F)
MC68H(R)C908JL3E/JK3E/JK1E — Rev. 2.0
MOTOROLA
Mechanical Specifications
Technical Data
213