PIC18F2450 Datasheet, PDF (304/320 Pages) Microchip Technology – 28/40/44-Pin, High-Performance, 12 MIPS, Enhanced Flash, USB Microcontrollers with nanoWatt Technology

PIC18F2450/4450
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
E
EXPOSED
METAL PAD
K
(NOTE 2)
p
D
D2
2
B
1
OPTIONAL
INDEX AREA
(NOTE 1)
n
PIN 1
INDEX ON
EXPOSED PAD
(PROFILE MAY VARY)
E2
L
TOP VIEW
BOTTOM VIEW
DETAIL: CONTACT VARIANTS
A
A3
A1
Units
Dimension Limits
Number of Contacts
n
Pitch
p
Overall Height
A
Standoff
A1
Base Thickness
A3
Overall Width
E
Exposed Pad Width
E2
Overall Length
D
Exposed Pad Length
D2
Contact Width
B
Contact Length
§
L
Contact-to-Exposed-Pad §
K
INCHES
MIN
NOM
44
.026 BSC
.031
.035
.000
.001
.010 REF
.309
.315
.236
.258
.309
.315
.236
.258
.008
.013
.014
.016
.014
-
MAX
.039
.002
.321
.260
.321
.260
.013
.019
-
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: M0-220
Drawing No. C04-103
MILLIMETERS*
MIN
NOM
44
0.65 BSC
0.80
0.90
0
0.02
0.25 REF
7.85
8.00
5.99
6.55
7.85
8.00
5.99
6.55
0.20
0.33
0.35
0.40
0.20
-
MAX
1.00
0.05
8.15
6.60
8.15
6.60
0.35
0.48
-
Revised 09-12-05
DS39760A-page 302
Advance Information
© 2006 Microchip Technology Inc.