PIC18F2450 Datasheet, PDF (301/320 Pages) Microchip Technology – 28/40/44-Pin, High-Performance, 12 MIPS, Enhanced Flash, USB Microcontrollers with nanoWatt Technology

PIC18F2450/4450
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
E
E2
EXPOSED
METAL
PAD
(NOTE 2)
e
D
D2
b
2
1
K
TOP VIEW
n
OPTIONAL
INDEX
AREA
(NOTE 1)
ALTERNATE
INDEX
INDICATORS
SEE DETAIL
L
BOTTOM VIEW
A1
A
DETAIL
ALTERNATE
PAD OUTLINE
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
n
28
Pitch
e
.026 BSC
Overall Height
A
.031
.035
.039
Standoff
A1
.000
.001
.002
Contact Thickness
A3
.008 REF
Overall Width
E
.232
.236
.240
Exposed Pad Width
E2
.153
.167
.169
Overall Length
D
.232
.236
.240
Exposed Pad Length
D2
.153
.167
.169
Contact Width
β
.009
.011
.013
Contact Length §
L
.018
.022
.024
Contact-to-Exposed Pad
§
K
.008
–
–
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
JEDEC equivalent: MO-220
Drawing No. C04-105
MILLIMETERS*
MIN
NOM
28
0.65 BSC
0.80
0.90
0.00
0.02
0.20 REF
5.90
6.00
3.89
4.24
5.90
6.00
3.89
4.24
0.23
0.28
0.45
0.55
0.20
–
MAX
1.00
0.05
6.10
4.29
6.10
4.29
0.33
0.65
–
Revised 09-12-05
© 2006 Microchip Technology Inc.
Advance Information
DS39760A-page 299