PIC18F2450 Datasheet, PDF (302/320 Pages) Microchip Technology – 28/40/44-Pin, High-Performance, 12 MIPS, Enhanced Flash, USB Microcontrollers with nanoWatt Technology

PIC18F2450/4450
40-Lead Plastic Dual In-line (P) – 600 mil Body (PDIP)
E1
D
2
α
n
1
E
β
eB
A
c
A1
A2
L
B1
B
p
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
40
p
.100
40
2.54
Top to Seating Plane
A
.160
.175
.190
4.06
4.45
4.83
Molded Package Thickness
A2
.140
.150
.160
3.56
3.81
4.06
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.595
.600
.625
15.11
15.24
15.88
Molded Package Width
E1
.530
.545
.560
13.46
13.84
14.22
Overall Length
D
2.045
2.058
2.065
51.94
52.26
52.45
Tip to Seating Plane
L
.120
.130
.135
3.05
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.030
.050
.070
0.76
1.27
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
§
eB
.620
.650
.680
15.75
16.51
17.27
Mold Draft Angle Top
α
5
10
15
5
10
15
Mold Draft Angle Bottom
β
5
10
15
5
10
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
DS39760A-page 300
Advance Information
© 2006 Microchip Technology Inc.