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| MAX11410 Datasheet, PDF (7/95 Pages) Maxim Integrated Products – 24-Bit Multi-Channel Low-Power | |||
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MAX11410
24-Bit Multi-Channel Low-Power
1.9ksps Delta-Sigma ADC with PGA
Absolute Maximum Ratings
AVDD to GND (GND = AGND = DGND)...............-0.3V to +3.6V
VDDIO to GND (GND = AGND = DGND)................-0.3V to 3.6V
AVDD to VDDIO........................................................-0.3V to 1.8V
Analog Inputs (AIN__, REF__) to AGND
(GND = AGND = DGND) .......................-0.3V to AVDD + 0.3V
CAPP, CAPN, VDDREG, CAPREG to GND
(GND = AGND = DGND)........................-0.3V to AVDD + 0.3V
Digital Inputs and Outputs to GND
(GND = AGND = DGND)...................... -0.3V to VDDIO + 0.3V
GPIO Inputs to GND (GND = AGND = DGND)
................................................................-0.3V to AVDD + 0.3V
Maximum Current Into Any Pin...........................................50mA
ESD Ratingâll Pins...............................................................2kV
Continuous Power Dissipation
(Single-Layer Board, TA = +70°C, derate 20.8).........1667mW
Continuous Power Dissipation
(Multilayer Board, TA = +70°C,
derate 28.6mW/°C above +70°C).............................. 2286mW
Operating Temperature Range.......................... -40°C to +125°C
Junction Temperature.......................................................+150°C
Storage Temperature Range............................. -40°C to +150°C
Lead Temperature (soldering, 10 sec)............................. +300°C
Soldering Temperature (reflow).......................................+260°C
Stresses beyond those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
Thermal Resistance, Single-Layer Board (TQFN)
Junction-to-Ambient Thermal Resistance (θJA)...........48°C/W
Junction-to-Case Thermal Resistance (θJC)..................3°C/W
Thermal Resistance, Four-Layer Board (TQFN)
Junction-to-Ambient Thermal Resistance (θJA)...........35°C/W
Junction-to-Case Thermal Resistance (θJC)..................3°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(AVDD = +3.3V, VDDIO = +1.8V, VREFP - VREFN = AVDD, TA = TMIN to TMAX, unless otherwise noted., TA=+25°C for typical specifica-
tions, unless otherwise noted, Note 1 )
PARAMETER
ANALOG INPUTS
Full-Scale Input Voltage
Absolute Input Voltage
Input Voltage Range
SYMBOL
CONDITIONS
Buffers disabled
Unipolar
Bipolar
AIN buffers/PGA disabled
Buffers enabled
Common Mode Voltage
Range
VCM
PGA gain = 1 to 16
MIN
TYP
MAX UNITS
±VREF/
Gain
AGND -
30mV
0
-VREF
AGND
AGND
+ 0.1
AVDD +
30mV
V
VREF
V
VREF
AVDD
AVDD
- 0.1
AGND
+ 0.1 +
(VIN)
(Gain)/2
AVDD
- 0.1 -
(VIN)
V
(Gain)/2
PGA gain = 32 to 128
AGND +
0.2 +
(VIN)
(Gain)/2
AVDD -
0.2
- (VIN)
(Gain)/2
www.maximintegrated.com
Maxim Integrated ââ 7
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