ISL78229 Datasheet, PDF (6/71 Pages) Intersil Corporation – 2-Phase Boost Controller with Drivers

ISL78229
Functional Pin Description (Continued)
PIN NAME
HIC/LATCH
ATRK/DTRK
RDT
VCC
PAD
PIN #
37
38
39
40
-
DESCRIPTION
This pin is used to select either Hiccup or Latch-off response to faults including output overvoltage (monitoring the FB
pin), output undervoltage (monitoring the FB pin, default inactive), V_IN overvoltage (monitoring the FB pin), peak
overcurrent protection (OC2), average current protection (monitoring the IMON pin) and over-temperature protection
(monitoring the NTC pin), etc.
HIC/LATCH = HIGH to activate the Hiccup fault response.
HIC/LATCH = LOW to have the Latch-off fault response. Either toggling the EN pin or recycling VCC POR resets the IC from
Latch-off status.
Refer to “Fault Response Register SET_FAULT_RESPONSE (D2h)” on page 35 and Table 3 on page 41 for more details.
The logic input pin to select the input signal format options for the TRACK pin. Pull this pin HIGH for the TRACK pin to
accept analog input signals. Pull this pin LOW for the TRACK pin to accept digital input signals. Refer to “Digital/Analog
TRACK Function” on page 26 for more details.
A resistor connected from this pin to ground programs the dead times between UGx OFF to LGx ON and LGx OFF to UGx
ON to prevent shoot-through. Refer to “Driver Configuration” on page 25 for the selection of R_DT.
IC bias power input pin for the internal analog circuitry. A minimum 1µF ceramic capacitor should be used between VCC
and ground for noise decoupling purposes. VCC is typically biased by PVCC or an external bias supply with voltage ranging
from 4.75V to 5.5V. Since PVCC is providing pulsing drive current, a small resistor like 10Ω or smaller between PVCC and
VCC can help to filter out the noises from PVCC to VCC.
Bottom thermal pad. It is not used as an electrical connection to the IC. In layout it must be connected to PCB large ground
copper plane that doesn’t contain noisy power flows. Put multiple vias (as many as possible) in this pad connecting to the
ground copper plane to help reduce the IC’s _JA.
Ordering Information
PART
NUMBER
(Notes 1, 2, 3)
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG.
DWG. #
ISL78229ARZ
ISL7822 9ARZ
-40 to +125
40 Ld 6x6 WFQFN
L40.6x6C
ISL78229EV1Z
Evaluation Board
NOTES:
1. Add “-T” suffix for 4k unit or “-T7A” suffix for 250 unit Tape and Reel options. Refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu-Ag plate
- e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see device information page for ISL78229. For more information on MSL see techbrief TB363.
PART
NUMBER
ISL78229ARZ
ISL78227ARZ
TABLE 1. KEY DIFFERENCES BETWEEN FAMILY OF PARTS
TOPOLOGY
2-Phase Boost Controller
2-Phase Boost Controller
PMBus™
Yes
No
NTC
TRACK FUNCTION
PACKAGE
Yes
Yes
40 Ld 6x6 WFQFN
No
Yes
32 Ld 5x5 WFQFN
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6
FN8656.3
February 12, 2016