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MC9S08LC60 Datasheet, PDF (324/358 Pages) Freescale Semiconductor, Inc – Microcontrollers
Appendix A Electrical Characteristics
A.3 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take PI/O into account in power calculations, determine the difference between
actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very
small.
Table A-2. Thermal Characteristics
Rating
Symbol
Value
Unit
Operating temperature range (packaged)
TA
Thermal resistance
-40 to 85
°C
80-pin LQFP
64-pin LQFP
1s
2s2p
1s
2s2p
θJA(1),
(2)
,
(3) (4)
,
64
49
°C/W
66
47
1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2 Junction to Ambient Natural Convection
3 1s - Single Layer Board, one signal layer
4 2s2p - Four Layer Board, 2 signal and 2 power layers
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)
Eqn. A-1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C)
Solving Equation A-1 and Equation A-2 for K gives:
Eqn. A-2
MC9S08LC60 Series Advance Information Data Sheet, Rev. 2
324
PRELIMINARY
Freescale Semiconductor