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10-503140-032 Datasheet, PDF (426/437 Pages) Amphenol Corporation – The Interconnection Leader
Amphenol Integrated Systems
The Leading Choice for Packaging Solutions
Amphenol
Aerospace
Amphenol is the leading manufacturer of integrated system
solutions for the military and aerospace markets. Amphenol
Integrated Systems is the synergistic combination of three
key divisions:
• Amphenol Aerospace
• Circular Interconnects
• Rectangular Board Level Products
• Amphenol Backplane Systems
• Amphenol Printed Circuits
We have over 60 years of experience in the military and aerospace
market and our commitment to the industry is exemplified in
everything we do. With our dedicated facilities in Nashua, New
Hampshire; Sidney, New York; and Nogales, Mexico, Amphenol
Integrated Systems is the military and aerospace industries
premier choice for system-level packaging solutions. We
understand the relationship between the interconnect, the
printed circuit board, the backplane and the chassis. We use
that knowledge to provide complete solutions for our customers.
Amphenol Products-Performance in the Most
Demanding Environments
We lead the industry by offering the elements necessary for
success in the military and aerospace OEM supply chain:
• Design and Modeling
• Applications Engineering
• Fabrication
• Value-added Assembly
• Test
Coupled with the largest interconnect offering in the market,
Amphenol supports all of your system-level needs.
Amphenol Backplane Systems and Printed Circuit Boards
Integrated System Packaging
Amphenol can provide systems solutions - everything you need
inside and outside the box: Interconnect products, printed circuit
boards, backplane assemblies, heat-sink and metal enclosures.
Amphenol also provides value added assembly including bussing:
full system assembly including chassis build and sub-system
integration and testing.
An example integrated system box, shown below, includes the
following Amphenol interconnect products:
• Circulars: D38999 circular connectors with MT Fiber Optics,
RJ Field Connectors
• Rectangulars: LRM interconnects, NAFI connectors, UHD
Connectors
• Rectangulars: ARINC 600 connectors, Micro-D Connectors
• Rectangulars: HDB3 High Density Brush contact Connectors
• Backplane Systems, Flex Circuitry, metal enclosure
Amphenol’s Solutions - The Pinnacle of Technology
Some of the world’s most demanding programs rely on
Amphenol’s packaging solutions, including:
• F-35
• F-22
• F-18
• MIDS/JTRS Radio
• Theater High Altitude Air Defense Radar (THAAD)
• AH-64 Apache
• 787 Dreamliner
• Future combat Systems
• DDG-51
• DDG-1000
Integrated Systems solutions are found aboard commer-
cial airliners, helicopters, Navy and Air force Fighters, C4I
electronics, missiles, ground vehicles, Homeland Security
Systems, and Navy warships.
Contact Amphenol Aerospace for more information at 800-678-0141 • www.amphenol-aerospace.com 425