MDS213 Datasheet, PDF (108/120 Pages) Zarlink Semiconductor Inc – 12-Port 10/100Mbps + 1Gbps Ethernet Switch

MDS213
Data Sheet
19.0 DC Electrical Characteristics
19.1 Absolute Maximum Ratings
Package: 456 HBGA (Heatslug BGA)
Storage Temperature: -65C to +150C
Operating Temperature: 0C to +70C
Maximum Junction Temperature:125C
Supply Voltage VCC with Respect to VSS +3.0 V to +3.6 V
Supply Voltage VDD with Respect to VSS +2.38 V to +2.75 V
Voltage on 5V Tolerant Input Pins
-0.5 V to (VCC + 3.3 V)
Caution: Stresses above those listed may cause permanent device failure. Functionality at or above these limits is
not implied. Exposure to the Absolute Maximum Ratings for extended periods may affect device reliability.
19.2 DC Electrical Characteristics
VCC = 3.0 V to 3.6 V (3.3v +/- 10%)T_AMBIENT = 0 C to +70 C
VDD = 2.5V +10% - 5%
Recommended Operating Conditions
Symbol
Parameter Description
Min
Type
Max
Unit
f_osc
I_CC
I_DD
V_OH
V_OL
V_IH-TTL
V_IL-TTL
I_IL
Frequency of Operation
Supply Current - @ 100 MHz (VCC =3.3 V)
Supply Current - @ 100 MHz (VDD =2.5 V)
Output High Voltage (CMOS)
Output Low Voltage (CMOS)
Input High Voltage (TTL 5V tolerant)
Input Low Voltage (TTL 5V tolerant)
Input Leakage Current (all pins except those
with internal pull-up/pull-down resistors)
100
MHz
270
351
mA
780
1014
mA
2.4
V
0.4
V
2.0
VCC + 2.0
V
0.8
V
10
µA
I_OL
Output Leakage Current
C_IN
Input Capacitance
C_OUT Output Capacitance
C_I/O
I/O Capacitance
θ_ja
Thermal resistance with 0 air flow
θ_ja
Thermal resistance with 1 m/s air flow
θ_ja
Thermal resistance with 2 m/s air flow
θ_jc
Thermal resistance between junction and case
Note 1: When external heat sink is attached, θ_JA is reduced by about 8-12% in still air.
10
µA
5
pF
5
pF
7
pF
12¹
C/W
11
C/W
9.6
C/W
3.3
C/W
108
Zarlink Semiconductor Inc.