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DS681 Datasheet, PDF (6/56 Pages) Xilinx, Inc – Fast look-ahead carry logic
R
Device
XA3S200A
XA3S400A
XA3S700A
XA3S1400A
Speed Grade
–4 Standard
Performance
Package Type / Number of Pins
Temperature Range (TJ)
FTG256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) I I-Grade (–40°C to 100°C)
FGG400 400-ball Fine-Pitch Ball Grid Array (FBGA)
FGG484 484-ball Fine-Pitch Ball Grid Array (FBGA)
Q Q-Grade (–40°C to 125°C)
Notes:
1. The XA Spartan-3A FPGA product line is available in -4 Speed Grade only.
DC Electrical Characteristics
All parameter limits are representative of worst-case supply
voltage and junction temperature conditions. Unless
otherwise noted, the published parameter values apply
to all XA Spartan-3A devices, and AC and DC
characteristics are specified using the same numbers
for both I-Grade and Q-Grade.
Absolute Maximum Ratings
Stresses beyond those listed under Table 4: Absolute
Maximum Ratings may cause permanent damage to the
device. These are stress ratings only; functional operation
of the device at these or any other conditions beyond those
listed under the Recommended Operating Conditions is not
implied. Exposure to absolute maximum conditions for
extended periods of time adversely affects device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Description
Conditions
Min
Max
Units
VCCINT Internal supply voltage
–0.5
1.32
V
VCCAUX Auxiliary supply voltage
–0.5
3.75
V
VCCO Output driver supply voltage
–0.5
3.75
V
VREF Input reference voltage
–0.5
VCCO + 0.5
V
Voltage applied to all User I/O pins and
VIN
Dual-Purpose pins
Driver in a high-impedance state
–0.95
4.6
V
Voltage applied to all Dedicated pins
–0.5
4.6
V
Electrostatic Discharge Voltage
Human body model
–
±2000
V
VESD
Charged device model
Machine model
–
±500
V
–
±200
V
TJ
TSTG
Junction temperature
Storage temperature
–
125
°C
–65
150
°C
Notes:
1. For soldering guidelines, see UG112: Device Packaging and Thermal Characteristics and XAPP427: Implementation and Solder Reflow
Guidelines for Pb-Free Packages.
6
www.xilinx.com
DS681 (v1.1) February 3, 2009
Product Specification