XC5000 Datasheet, PDF (39/48 Pages) Xilinx, Inc – High-density family of Field-Programmable Gate Arrays

R
Left
Bottom
Right
Top
25
R1C1
26
27
28
R2C1
29
30
31
R3C1
32
33
34
R4C1
35
36
37
R5C1
38
39
40
R6C1
41
42
43
R7C1
44
45
R8C1
46
47
R9C1
48
49
50
R10C1
51
52
53
R11C1
54
55
56
R12C1
57
58
59
R13C1
60
61
62
R14C1
63
64
65
R15C1
66
67
68
R16C1
69
70
71
R17C1
72
73
R18C1
74
75
76
R18C1
77
78
R18C2
79
80
81
R18C3
82
83
84
R18C4
85
86
87
R18C5
88
89
90
R18C6
91
92
R18C7
93
94
95
R18C8
96
97
98
R18C9
99
100
101
R18C10
102
103
104
R18C11
105
106
107
R18C12
108
109
110
R18C13
111
112
R18C14
113
114
R18C15
115
116
117
R18C16
118
119
120
R18C17
121
122
123
R18C18
R1C18
171
170
R2C18
169
168
167
R3C18
166
165
164
R4C18
163
162
161
R5C18
160
159
158
R6C18
157
156
155
R7C18
154
153
152
R8C18
151
150
R9C18
149
148
R10C18
147
146
R11C18
145
144
143
R12C18
142
141
140
R13C18
139
138
137
R14C18
136
135
R15C18
134
133
132
R16C18
131
130
129
R17C18
128
127
126
R18C18
125
124
24
R1C1
23
22
R1C2
21
20
19
R1C3
18
17
16
R1C4
15
14
13
R1C5
12
11
R1C6
10
9
R1C7
8
7
6
R1C8
5
4
3
R1C9
2
1
196
R1C10
195
194
193
R1C11
192
191
190
R1C12
189
188
187
R1C13
186
185
R1C14
184
183
182
R1C15
181
180
179
R1C16
178
177
176
R1C17
175
174
173
R1C18
172
Note: Pad numbers (1, 2, …, 196) refer to die pads, not external device pins. Also see the XC5210 pinout table on pages 38-39.
Figure 21. XC5210 CLB-to-Pad Relationship (Detail)
35