XC5000 Datasheet, PDF (29/48 Pages) Xilinx, Inc – High-density family of Field-Programmable Gate Arrays

R
Absolute Maximum Ratings
Symbol Description
Units
V_CC
Supply voltage relative to GND
-0.5 to +7.0
V
V_IN
Input voltage with respect to GND
-0.5 to V_CC +0.5
V
V_TS
Voltage applied to 3-state output
-0.5 to V_CC +0.5
V
T_STG Storage temperature (ambient)
-65 to +150
°C
T_SOL Maximum soldering temperature (10 s @ 1/16 in. = 1.5 mm)
+260
°C
Junction temperature in plastic packages
T_J
Junction temperature in ceramic packages
+125
°C
+150
°C
Note:
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
listed under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings
conditions for extended periods of time may affect device reliability.
Operating Conditions
Symbol Description
Supply voltage relative to GND
Commercial: 0°C to 70°C
V_CC
Supply voltage relative to GND
Industrial: -40°C to 85°C
Supply voltage relative to GND
Military: -55°C to 125°C
V_IHT
High-level input voltage — TTL configuration
V_ILT
Low-level input voltage — TTL configuration
V_IHC
High-level input voltage — CMOS configuration
V_ILC
Low-level input voltage — CMOS configuration
T_IN
Input signal transition time
Min
4.75
4.5
4.5
2.0
0
70%
0
Max Units
5.25 V
5.5
V
5.5
V
V_CC
V
0.8
V
100% V_CC
20%
V_CC
250
ns
DC Characteristics Over Operating Conditions
Symbol Description
Min Max Units
V_OH
High-level output voltage @ I_OH = -8.0 mA, V_CC min
3.86
V
V_OL
Low-level output voltage @ I_OL = 8.0 mA, V_CC max (Note 1)
0.4
V
I_CCO
Quiescent LCA supply current (Note 1)
15
mA
I_IL
Leakage current
-10
+10 µA
C_IN
Input capacitance (sample tested)
15
pF
I_RIN
Pad pull-up (when selected) @ V_IN = 0V (sample tested)
0.02 0.25 mA
Note: 1. With no output current loads, all package pins at V_CC or GND, and the LCA configured with a MakeBits tie option.
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