W681307DG Datasheet, PDF (18/160 Pages) Winbond – USB1.1 CODEC Microprocessor Control Unit with 32KB Mask ROM and 4KB RAM.

W681307
5.2
I/O Cells in Winbond MCU Chip
Chartered Semiconductor (Artisan) 0.25um Integral I/O cell library
PC3B02U
3V CMOS 3-State I/O Pad with Pull-up Resistor, 2mA
VDD
OEN
I
PAD
CIN
Figure 5-1: PC3B02U pad
PC3B02D
3V CMOS 3-State I/O Pad with Pull-down Resistor, 2mA
OEN
I
CIN
VSS
Figure 5-2: PC3B02D pad
PC3o02
3V CMOS Output Pad, 2mA
I
PAD
PAD
Figure 5-3: PC3o02 pad
PC3D01D
3V CMOS Input only Pad with Pull-down Resistor
PAD
CIN
VSS
Figure 5-4: PC3D01D pad
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Publication Release Date: May, 2007
Revision 1.3