TLK110 Datasheet, PDF (80/104 Pages) Texas Instruments – Industrial Temp, Single Port 10/100Mbs Ethernet Physical Layer

TLK110
SLLS901A – DECEMBER 2011 – REVISED FEBRUARY 2012
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
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9.1 ABSOLUTE MAXIMUM RATINGS⁽¹⁾
VDD33_IO, AVDD33
PFBIN1, PFBIN2
XI
TD-, TD+, RD-, RD+
Other Inputs
XO
Other outputs
T_J
ESD
Supply voltage
DC Input voltage
DC Output voltage
Maximum die temperature
Human-Body
Model
All pins⁽²⁾
Ethernet network pins (TD+, TD-, RD+, RD-)⁽³⁾
Charged-Device
Model
All pins⁽⁴⁾
VALUE
–0.3 to 3.8
–0.3 to 1.8
–0.3 to 3.8
–0.3 to 6
–0.3 to 3.8
–0.3 to 3.8
–0.3 to 3.8
125
±4
±16
±750
UNIT
V
V
V
°C
kV
V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance to JEDEC Standard 22, Test Method A114.
(3) Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with
respect to GND.
(4) Tested in accordance to JEDEC Standard 22, Test Method C101.
9.2 THERMAL CHARACTERISTICS
9.2.1 48-Pin Industrial Device Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
θ_JA
Junction-to-ambient thermal resistance (no airflow)
θ_JB
Junction-to-board thermal resistance
θ_JC
Junction-to-case thermal resistance
JEDEC high-K model
MIN
TYP
MAX UNIT
65.3
28.5
°C/W
23.1
9.2.2 48-Pin Extended Temperature (125°C) Device Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
θ_JA
Junction-to-ambient thermal resistance (no airflow)
JEDEC high-K model
41.8
θ_JB
Junction-to-board thermal resistance
20.0
θ_JC
Junction-to-case thermal resistance
24.7
MAX UNIT
°C/W
9.3 RECOMMENDED OPERATING CONDITIONS
MIN
VDD33_IO,
I/O and Analog 3.3V Supply
3.0
AVDD33
PFBIN1, PFBIN2
T_A
P_D
Core Supply voltage
Ambient temperature⁽¹⁾
Power dissipation⁽²⁾
1.43
–40
(1) Provided that GNDPAD, pin 49, is soldered down. See Thermal Vias Recommendation for more detail.
(2) For 100Base-TX, When internal 1.5V is used. Device is operated from single 3.3V supply only.
NOM
3.3
1.5
270
MAX UNIT
3.6 V
1.58 V
85 °C
mW
80
Electrical Specifications
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