TLK110 Datasheet, PDF (42/104 Pages) Texas Instruments – Industrial Temp, Single Port 10/100Mbs Ethernet Physical Layer

TLK110
SLLS901A – DECEMBER 2011 – REVISED FEBRUARY 2012
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7.3 Thermal Vias Recommendation
(Extended temperature (125°C) grade only)
The following thermal via guidelines apply to GNDPAD, pin 49:
1. Thermal via size = 0.2 mm
2. Recommend 4 vias
3. Vias have a center to center separation of 2 mm.
Adherence to this guideline is required to achieve the intended operating temperature range of the device.
Figure 7-3 illustrates an example layout.
Figure 7-3. Example Layout
M0117-01
42
Design Guidelines
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