SM320C6201_15 Datasheet, PDF (72/76 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SM320C6201, SMJ320C6201B
DIGITAL SIGNAL PROCESSORS
SGUS028A -- NOVEMBER 1998 -- REVISED JANUARY 1999
GLP (S-CBGA-N429)
MECHANICAL DATA
CERAMIC BALL GRID ARRAY
27,20
26,80 ^SQ
1,22
1,00
25,40 TYP
1,27
AA
Y
W
V
U
T
R
P
N
1,27
M
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11 13 15 17 19 21
2 4 6 8 10 12 14 16 18 20
3,30 MAX
0,90
∅ 0,10 M
0,60
Seating Plane
0,70
0,15
0,50
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-156
D. Flip chip application only
E. For 320C6201B (1.8 V core device).
F. Package weight for GLP is 7.65 grams.
thermal resistance characteristics (S-CBGA package)
NO
1 RΘ_JC
2 RΘ_JA
Junction-to-Case
Junction-to-Ambient
4164732/A 08/98
°C/W
1.7
14.4
Air Flow
N/A
0
72
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