SM320C6201_15 Datasheet, PDF (25/76 Pages) Texas Instruments – DIGITAL SIGNAL PROCESSORS

SM320C6201, SMJ320C6201B
DIGITAL SIGNAL PROCESSORS
SGUS028A -- NOVEMBER 1998 -- REVISED JANUARY 1999
device and development-support tool nomenclature (continued)
SMJ 320 C 6201 GGP --200
PREFIX
TMX =
TMP =
TMS =
SMX =
SMJ =
SM =
SMQ =
Experimental device
Prototype device
Qualified device
Prototype device
High Rel (Mil SMD)
High Rel (non-SMD)
Plastic (Mil SMD)
DEVICE FAMILY
320 = TMS320 family
TECHNOLOGY
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
DEVICE
’1x DSP:
10 16
14 17
15
’2x DSP:
25
26
’2xx DSP:
203 206 240
204 209
’3x DSP:
30
31
32
’4x DSP:
40
44
’5x DSP:
50 53
51 56
52 57
’54x DSP:
541 545
542 546
543 548
’6x DSP:
6201
6201B
6202
6211
6701
DEVICE SPEED RANGE
--150 MHz
--167 MHz
--200 MHz
--233 MHz
--250 MHz
PACKAGE TYPE^†
N = Plastic DIP
J = Ceramic DIP
JD = Ceramic DIP side-brazed
GB = Ceramic PGA
FZ = Ceramic CC
FN = Plastic leaded CC
FD = Ceramic leadless CC
PJ = 100-pin plastic EIAJ QFP
PQ = 132-pin plastic bumpered QFP
PZ = 100-pin plastic TQFP
PBK = 128-pin plastic TQFP
PGE = 144-pin plastic TQFP
GFN = 272-ball plastic BGA
GGU = 144-ball plastic BGA
GGP = 352-ball plastic BGA
GJC = 352-ball plastic BGA
GJL = 352-ball plastic BGA
GJL = 452-ball plastic BGA
GLE = 429-ball ceramic BGA
GLP = 429-ball ceramic BGA
† _{DIP =}
PGA =
CC =
QFP =
TQFP =
BGA =
Dual-In-Line Package
Pin Grid Array
Chip Carrier
Quad Flat Package
Thin Quad Flat Package
Ball Grid Array
Figure 6. TMS320 Device Nomenclature (Including SM320C6201/SMJ320C6201B)
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