DS125RT410_15 Datasheet, PDF (5/58 Pages) Texas Instruments – Low-Power Multi-Rate Quad Channel Retimer

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DS125RT410
SNLS459A – APRIL 2013 – REVISED OCTOBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
See ⁽¹⁾⁽²⁾
Supply voltage (V_DD)
2.5 I/O voltage (LVCMOS and analog)
3.3 LVCMOS I/O voltage (SDA, SDC, INT)
Signal input voltage (RXPn, RXNn)
Signal output voltage (TXPn, TXNn)
Junction temperature
Storage temperature, T_stg
MIN
MAX
UNIT
–0.5
2.75
V
–0.5
2.75
V
–0.5
4.0
V
–0.5
2.75
V
–0.5
2.75
V
150
°C
–65
150
°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated outside these conditions.
(2) For soldering specifications: see SNOA549.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
Machine model, STD - JESD22-A115-A
VALUE
±6000
±1250
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
Supply voltage V_DD to GND
Ambient temperature
MIN
2.375
–40
NOM
2.5
25
MAX
2.625
85
UNIT
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DS125RT410
RHS (WQFN)
UNIT
48 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
29.2
°C/W
10.2
°C/W
6.1
°C/W
0.1
°C/W
6.1
°C/W
2.0
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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