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K4J52324QC Datasheet, PDF (36/57 Pages) Samsung semiconductor – 512Mbit GDDR3 SDRAM
K4J52324QC-B
READ to PRECHARGE
T0
T1
T2
/CK
CK
COMMAND
READ
NOP
PRE
ADDRESS
Bank a,
Col n
Bank a,
(a or all)
CL = 8
RDQS
512M GDDR3 SDRAM
T8
T8n
T9
T9n T10
NOP
NOP
tRP
ACT
Bank a,
Row
DQ
/CK
CK
COMMAND
ADDRESS
T0
READ
Bank a,
Col n
RDQS
DO
n
T1
T7
T8
T8n
T9
NOP
PRE
Bank a,
(a or all)
CL = 8
NOP
NOP
tRP
T10
ACT
Bank a,
Row
DQ
DO
n
DON’T CARE
TRANSITIONING DATA
NOTE : 1. DO n (or b) = data-out from column n (or column b).
2. Burst length = 4
3. Three subsequent elements of data-out appear in the programmed order following DQ n.
4. Three subsequent elements of data-out appear in the programmed order following DQ b.
5. Shown with nominal tAC and tDQSQ.
6. Example applies when READ commands are issued to different devices or nonconsecutive READs.
7. RDQS will start driving high one half-clock cycle prior to the first falling edge of RDQS.
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Rev 1.0 (Mar 2005)