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K4J52324QC Datasheet, PDF (30/57 Pages) Samsung semiconductor – 512Mbit GDDR3 SDRAM
K4J52324QC-B
512M GDDR3 SDRAM
Data Output Timing (1) - tDQSQ, tQH and Data Valid Window
T0
CK#
CK
RDQS 1.6
T1
T2
T2n
T3
T3n
T4
tCH
tCH
tDQSQ2 (MAX)
tDQSQ2 (MIN)
tDQSQ2 (MAX)
tDQSQ2 (MIN)
DQ(Last data valid)
tDQSH4 tDQSH4
T2
T2n
T3
T3n
DQ(First data no longer valid)
All DQs and RDQS, collectively5
T2
T2n
T3
T3n
T2
tDV4
T2n
tDV4
T3
tDV4
T3n
tDV4
Data Output Timing (2) - tDQSQ, tQH and Data Valid Window
T0
T1
T2
T2n
T3
T3n
T4
CK#
CK
tCH
tCH
RDQS 1.6
tAC(MAX)
All DQs and RDQS, collectively5
tDQSH4 tDQSH4
T2
T2n
T3
T3n
RDQS 1.6
tAC(MIN)
All DQs and RDQS, collectively5
tDQSH4 tDQSH4
T2
T2n
T3
T3n
Note : 1. tDQSQ represents the skew between the 8 DQ lines and the respective RDQS pin.
2. tDQSQ is derived at each RDQS clock edge and is not cumulative over time and begins with first DQ transition and ends
with the last valid transition of DQs.
3. tAC is show in the nominal case
4. tDQHP is the lesser of tDQSL or tDQSH strobe transition collectively when a bank is active.
5. The data valid window is derived for each RDQS transitions and is defined by tDV.
6. There are 4 RDQS pins for this device with RDQS0 in relation to DQ0-DQ7, RDQS1 in relation DQ8-DQ15, RDQS2 in
relation to DQ16-24 and RDQS3 in relation to DQ25-DQ31.
7. This diagram only represents one of the four byte lanes.
8. tAC represents the relationship between DQ, RDQS to the crossing of CK and /CK.
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Rev 1.0 (Mar 2005)