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RX71M_15 Datasheet, PDF (1/228 Pages) Renesas Technology Corp – Renesas MCUs | |||
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Features
Datasheet
RX71M Group
Renesas MCUs
R01DS0249EJ0100
Rev.1.00
240-MHz 32-bit RX MCU, on-chip FPU, 480 DMIPS, up to 4-MB flash memory,
Jan 15, 2015
512-KB SRAM, various communications interfaces including IEEE 1588-compliant Ethernet MAC,
high-speed USB 2.0 with battery charging, SD host interface (optional), quad SPI, and CAN, 12-bit A/D
converter, RTC, encryption (optional), serial interface for audio, CMOS camera interface
Features
â 32-bit RXv2 CPU core
ï· Max. operating frequency: 240 MHz
Capable of 480 DMIPS in operation at 240 MHz
ï· Single precision 32-bit IEEE-754 floating point
ï· Two types of multiply-and-accumulation unit (between memories
and between registers)
ï· 32-bit multiplier (fastest instruction execution takes one CPU clock
cycle)
ï· Divider (fastest instruction execution takes two CPU clock cycles)
ï· Fast interrupt
ï· CISC Harvard architecture with 5-stage pipeline
ï· Variable-length instructions: Ultra-compact code
ï· Supports the memory protection unit (MPU)
ï· JTAG and FINE (one-line) debugging interfaces
â Low-power design and architecture
ï· Operation from a single 2.7- to 3.6-V supply
ï· Low power consumption: A product that supports all peripheral
functions draws only 0.2mA/MHz (Typ.).
ï· RTC is capable of operation from a dedicated power supply.
ï· Four low-power modes
â On-chip code flash memory
ï· Supports versions with up to 4 Mbytes of ROM
ï· No wait states at up to 120 MHz or when the AFU is hit, one wait
state at above 120 MHz and when the AFU is missed
ï· User code is programmable by on-board or off-board programming.
ï· Programming/erasing as background operations (BGOs)
â On-chip data flash memory
ï· 64 Kbytes, reprogrammable up to 100,000 times
ï· Programming/erasing as background operations (BGOs)
â On-chip SRAM
ï· 512 Kbytes of SRAM (no wait states except in the 256 Kbytes from
0004 0000h to 0007 FFFFh when ICLK is set to 120 MHz or faster)
ï· 32 Kbytes of RAM with ECC (single-error correction and double
error detection)
ï· 8 Kbytes of standby RAM (backup on deep software standby)
â Data transfer
ï· DMAC: 8 channels
ï· DTC
ï· EXDMAC: 2 channels
ï· DMAC for the Ethernet controller: 3 channels for 176- and 177-pin
products; 2 channels for 100-, 144-, and 145-pin products
â Reset and supply management
ï· Power-on reset (POR)
ï· Low voltage detection (LVD) with voltage settings
â Clock functions
ï· External crystal oscillator or internal PLL for operation at 8 to 24
MHz
ï· Internal 240-kHz LOCO and HOCO selectable from 16, 18, and 20
MHz
ï· 120-kHz clock for the IWDTa
â Real-time clock
ï· Adjustment functions (30 seconds, leap year, and error)
ï· Real-time clock counting and binary counting modes are selectable
ï· Time capture function
(for capturing times in response to event-signal input)
â Independent watchdog timer
ï· 120-kHz (1/2 LOCO frequency) clock operation
â Useful functions for IEC60730 compliance
ï· Oscillation-stoppage detection, frequency measurement, CRC,
IWDTa, self-diagnostic function for the A/D converter, etc.
ï· Register write protection function can protect values in important
registers against overwriting.
PLQP0176KB-A 24 Ã 24 mm, 0.5-mm pitch
PLQP0144KA-A 20 Ã 20 mm, 0.5-mm pitch
PLQP0100KB-A 14 Ã 14 mm, 0.5-mm pitch
PTLG0177KA-A 8 Ã 8 mm, 0.5-mm pitch
PTLG0145KA-A 7 Ã 7 mm, 0.5-mm pitch
PTLG0100JA-A 7 Ã 7 mm, 0.65-mm pitch
PLBG0176GA-A 13 Ã 13mm, 0.8-mm pitch
â Various communications interfaces
ï· IEEE 1588-compliant Ethernet MAC
(for 176- and 177-pin products: 2 modules)
ï· PHY layer for host/function or OTG controller (1) with high-speed
USB 2.0 with battery charging transfer (only for 176- and 177-pin
products)
ï· PHY layer (1) for host/function or OTG controller (1) with full-
speed USB 2.0 transfer
ï· CAN (compliant with ISO11898-1), incorporating 32 mailboxes (up
to 3 modules)
ï· SCIg and SCIh with multiple functionalities (up to 9)
Choose from among asynchronous mode, clock-synchronous mode,
smart-card interface mode, simplified SPI, simplified I2C, and
extended serial mode.
ï· SCIFA with 16-byte transmission and reception FIFOs (up to 4
interfaces)
ï· I2C bus interface for transfer at up to 1 Mbps (up to 2 interfaces)
ï· Four-wire QSPI (1 interface) in addition to RSPIa (2 interfaces)
ï· Parallel data capture unit (PDC) for the CMOS camera interface (not
in 100-pin products)
ï· SD host interface (optional: 1 interface) with a 1- or 4-bit SD bus for
use with SD memory or SDIO
ï· MMCIF with 1-, 4-, or 8-bit transfer bus width
â External address space
ï· Buses for full-speed data transfer (max. operating frequency of 60
MHz)
ï· 8 CS areas
ï· 8-, 16-, or 32-bit bus space is selectable per area
ï· Independent SDRAM area (128 Mbytes)
â Up to 29 extended-function timers
ï· 16-bit TPUa, MTU3a, and GPTa: input capture, output compare,
PWM waveform output
ï· 8-bit TMRa (4 channels), 16-bit CMT (4 channels), 32-bit CMTW (2
channels)
â 12-bit A/D converter
ï· Two 12-bit units (8 channels for unit 0; 21 channels for unit 1)
ï· Self diagnosis
ï· Detection of analog input disconnection
â 12-bit D/A converter: 2 channels
ï· On-chip operational amplifier output or direct input selectable
â Temperature sensor for measuring temperature
within the chip
â Encryption (optional)
ï· AES (key lengths: 128, 196, and 256 bits)
ï· DES (key lengths: 56 bits (DES); 3 Ã 56 bits (T-DES))
ï· SHA (SHA-1 (128), SHA-2 (224 or 256), HMAC (160, 224, or 256))
â Up to 127 pins for general I/O ports
ï· 5-V tolerance, open drain, input pull-up, switchable driving ability
â Operating temp. range
ï· â40ï°C to +85ï°C
R01DS0249EJ0100 Rev.1.00
Jan 15, 2015
Page 1 of 228
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