CLRC663 Datasheet, PDF (124/132 Pages) NXP Semiconductors – Contactless reader IC

NXP Semiconductors
CLRC663
Contactless reader IC
Detailed package information can be found at
http://www.nxp.com/package/SOT617-1.html.
16. Handling information
Moisture Sensitivity Level (MSL) evaluation has been performed according to
SNW-FQ-225B rev.04/07/07 (JEDEC J-STD-020C). MSL for this package is level 2 which
means 260 C convection reflow temperature.
Dry pack is required.
1 year out-of-pack floor life at maximum ambient temperature 30 C/ 85 % RH.
17. Packing information
The straps around the package of
stacked trays inside the piano-box
have sufficient pre-tension to avoid
loosening of the trays.
strap 46 mm from corner
tray
chamfer
PIN 1
chamfer
PIN 1
printed piano box
Fig 38. Packing information 1 tray
ESD warning preprinted
barcode label (permanent)
barcode label (peel-off)
QA seal
Hyatt patent preprinted
In the traystack (2 trays)
only ONE tray type* allowed
*one supplier and one revision number.
001aaj740
CLRC663
Product data sheet
COMPANY PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.3 — 3 April 2012
171133
© NXP B.V. 2012. All rights reserved.
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