MC68HC05J3 Datasheet, PDF (81/92 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

A
Case 738-03
B
1
G
L
NC
K
E
F
D
M
J
Seating
plane
Dim.
A
B
C
D
E
F
Min. Max.
25.66 27.17
6.10 6.60
3.81 4.57
0.39 0.55
1.27 BSC
1.27 1.77
Notes
1. All dimensions in mm.
2. Positional tolerance of leads (‘D’) shall be within 0.25 mm at
maximum material condition, in relation to seating plane and to
each other.
3. Dimension ‘L’ is to centre of leads when formed parallel.
4. Dimension ‘B’ does not include mould protrusion.
Dim. Min. Max.
G
2.54 BSC
J
0.21 0.38
K
2.80 3.55
L
7.62 BSC
M
0° 15°
N
0.51 1.01
Figure 10-4 20-pin PDIP mechanical dimensions
10
MC68HC05J3
MECHANICAL DATA
TPG
MOTOROLA
10-3