MC68HC05J3 Datasheet, PDF (80/92 Pages) Motorola, Inc – High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

–A–
Case 751D-03
1
–B–
P
0.25 M B M
10 PL
G
C _{–T–}
D 20 PL
K
Seating
M
plane
0.25 M T B S A S
R x 45°
J
F
10
Dim.
A
B
C
D
F
G
Min. Max.
12.65 12.95
7.40 7.60
2.35 2.65
0.35 0.49
0.50 0.90
1.27 BSC
Notes
1. Dimensions ‘A’ and ‘B’ are datums and ‘T’ is a datum surface.
2. Dimensioning and tolerancing per ANSI Y14.5M, 1982.
3. All dimensions in mm.
4. Dimensions ‘A’ and ‘B’ do not include mould protrusion.
5. Maximum mould protrusion is 0.15 mm per side.
Dim. Min. Max.
J
0.25 0.32
K
0.10 0.25
M
0°
7°
P 10.05 10.55
R 0.25 0.75
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—
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Figure 10-3 20-pin SOIC mechanical dimensions
MOTOROLA
10-2
MECHANICAL DATA
TPG
MC68HC05J3