XPGA Datasheet, PDF (1/89 Pages) Lattice Semiconductor – The ispXPGA architecture

ispXPGA^TM Family
March 2003
Preliminary Data Sheet
■ Non-volatile, Infinitely Reconfigurable
• Instant-on - Powers up in microseconds via
on-chip E²CMOS^® based memory
• No external configuration memory
• Excellent design security, no bit stream to intercept
• Reconfigure SRAM based logic in milliseconds
■ High Logic Density for System-level
Integration
• 139K to 1.25M system gates
• 160 to 496 I/O
• 1.8V, 2.5V, and 3.3V V_CC operation
• Up to 414Kb sysMEM™ embedded memory
■ High Performance Programmable Function
Unit (PFU)
• Four LUT-4 per PFU supports wide and narrow
functions
• Dual flip-flops per LUT-4 for extensive pipelining
• Dedicated logic for adders, multipliers, multiplex-
ers, and counters
■ Variable-Length Interconnect Routing
Technology
• Optimum speed, power, and flexibility for logic
interconnections
■ Flexible Memory Resources
• Multiple sysMEM Embedded RAM Blocks
– Single port, Dual port, and FIFO operation
• 64-bit distributed memory in each PFU
– Single port, Double port, FIFO, and Shift
Register operation
Table 1. ispXPGA Family Selection Guide
■ Eight sysCLOCK™ Phase Locked Loops
(PLLs) for Clock Management
• True PLL technology
• 10MHz to 320MHz operation
• Clock multiplication and division
• Phase adjustment
• Shift clocks in 250ps steps
■ sysIO™ for High System Performance
• High speed memory support through SSTL and
HSTL
• Advanced buses supported through PCI, GTL+,
LVDS, BLVDS, and LVPECL
• Standard logic supported through LVTTL,
LVCMOS 3.3, 2.5, and 1.8
• Programmable drive strength for series termination
• Programmable bus maintenance
■ sysHSI™ Capability for Ultra Fast Serial
Communications
• Up to 850Mbps performance
• Up to 20 channels per device
• Built in Clock Data Recovery (CDR) and
Serialization and De-serialization (SERDES)
■ Flexible Programming, Reconfiguration,
and Testing
• IEEE 1532 and 1149.1 compliant
• Microprocessor configuration interface
• Program E²CMOS while operating from SRAM
ispXPGA 125
ispXPGA 200
ispXPGA 500
ispXPGA 1200
System Gates
139K
210K
476K
1.25M
PFUs
484
676
1764
3844
LUT-4s
1936
2704
7056
15376
Logic FFs
3.8K
5.4K
14.1K
30.7K
sysMEM Memory
92K
111K
184K
414K
Distributed Memory
30K
43K
112K
246K
EBR
20
24
40
90
sysHSI Channels
4
8
12
20
User I/O
160/176
160/208
336
496
Packaging
256 fpBGA
516 fpBGA¹
256 fpBGA
516 fpBGA¹
516 fpBGA¹
900 fpBGA
680 fpSBGA¹
900 fpBGA
1. Thermally enhanced package.
Note: LFX1200B/C is preliminary, LFX125/200/500B/C information is advanced.
© 2003 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
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