I960 Datasheet, PDF (27/70 Pages) Intel Corporation – i960 RP/RD I/O PROCESSOR AT 3.3 VOLTS

3.1.2 352-Lead HL-PBGA Package
Body Size
35 ± 0.10 mm
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Ball A1 Corner
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35 ± 0.10 mm
1.63 mm
0.63 ± 0.07 mm
1.54 ± 0.13 mm
Ball Footprint
31.75 mm
Ball spacing is 1.27 mm
Ball width is 0.75 ± 0.15 mm
Package Height
0.91 ± 0.06 mm
NOTES:
1. All dimensions and tolerances conform to ANSI Y14.5M 1982.
2. All dimensions are in millimeters.
3. Tin/Lead mix: 63%/37%.
4. Pad plating method: Electrolytic.
5. Encapsulant size: 22.38 x 22.38 mm (max).
Figure 3. 352L HL-PBGA Package Diagram (Top and Side View)
ADVANCE INFORMATION
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