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HYB25D256161CE Datasheet, PDF (48/72 Pages) Infineon Technologies AG – 16M x 16 Double Data Rate Graphics DRAM
HYB25D256161CE-[4/5]
256-Mbit Double Data Rate SGRAM
Electrical Characteristics
4
Electrical Characteristics
4.1
Operating Conditions
Table 11 Absolute Maximum Ratings
Parameter
Symbol
Min.
Voltage on I/O pins relative to VSS
Voltage on Inputs relative to VSS
Voltage on VDD supply relative to VSS
Voltage on VDDQ supply relative to VSS
Operating Temperature (Ambient)
Storage Temperature (Plastic)
Power Dissipation
Short Circuit Output Current
VIN, VOUT –0.5
VIN
–0.5
VDD
–0.5
VDDQ
–0.5
TA
0
TSTG
–55
PD
—
IOUT
—
Values
Typ.
—
—
—
—
—
—
1.5
50
Max.
Unit Note/
Test Condition
VDDQ + 0.5 V —
+3.6
V—
+3.6
V—
+3.6
V—
+70
°C —
+150
°C —
—
W—
—
mA —
Attention: Stresses above those listed here may cause permanent damage to the device. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Maximum ratings are absolute ratings; exceeding only one of these values may cause
irreversible damage to the integrated circuit.
Table 12 Input and Output Capacitances
Parameter
Symbol
Input Capacitance: CK, CK
CI1
Delta Input Capacitance
CdI1
Input Capacitance:
CI2
All other input-only pins
Delta Input Capacitance:
CdIO
All other input-only pins
Input/Output Capacitance: DQ, DQS, DM CIO
Min.
2.0
—
2.0
—
4.0
Values
Unit
Typ. Max.
—
3.0
pF
—
0.25 pF
—
3.0
pF
—
0.5
pF
—
5.0
pF
Note/
Test Condition
P-TSOPII-66-11)
1)
P-TSOPII-66-1 1)
1)
P-TSOPII-66-1
2)1)2)
Delta Input/Output Capacitance:
DQ, DQS, DM
CdIO
—
—
0.5
pF
1)
1) These values are guaranteed by design and are tested on a sample base only. VDDQ = VDD = 2.5 V ± 0.2 V, f = 100 MHz,
TA = 25 °C, VOUT(DC) = VDDQ/2, VOUT (Peak to Peak) 0.2 V. Unused pins are tied to ground.
2) DM inputs are grouped with I/O pins reflecting the fact that they are matched in loading to DQ and DQS to facilitate trace
matching at the board level.
Datasheet
48
Rev.1.0, 2004-02