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TLE94106EL Datasheet, PDF (12/75 Pages) Infineon Technologies AG – Six half bridge power outputs | |||
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TLE94106EL
General Product Characteristics
3.3
Thermal Resistance
Table 4 Thermal Resistance TLE94106EL
Parameter
Symbol
Values
Unit Note or
Number
Min. Typ. Max.
Test Condition
Junction to Case, TA = -40°C
RthjC_cold â
7â
Junction to Case, TA = 85°C
RthjC_hot â
9â
Junction to ambient, TA = -40°C RthjA_cold_ â
(1s0p, minimal footprint)
min
80 â
Junction to ambient, TA = 85°C RthjA_hot_m â
(1s0p, minimal footprint)
in
85 â
Junction to ambient, TA = -40°C RthjA_cold_3 â
(1s0p, 300mm2 Cu)
00
51 â
Junction to ambient, TA = 85°C RthjA_hot_30 â
(1s0p, 300mm2 Cu)
0
58 â
Junction to ambient, TA = -40°C RthjA_cold_6 â
(1s0p, 600mm2 Cu)
00
51 â
Junction to ambient, TA = 85°C RthjA_hot_60 â
(1s0p, 600mm2 Cu)
0
58 â
Junction to ambient, TA = -40°C RthjA_cold_2 â
(2s2p)
s2p
35 â
Junction to ambient, TA = 85°C RthjA_hot_2s â
(2s2p)
2p
44 â
1) Not subject to production test, specified by design.
K/W 1)
K/W 1)
K/W 1) 2)
K/W 1) 2)
K/W 1) 3)
K/W 1) 3)
K/W 1) 4)
K/W 1) 4)
K/W 1) 5)
K/W 1) 5)
2) Specified RthJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with minimal footprint copper area and 35µm thickness.
Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
3) Specified RthJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with additional cooling of 300mm2 copper area and 35µm
thickness. Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
4) Specified RthJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 1s0p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with additional cooling of 600mm2 copper area and 35µm
thickness. Ta = -40°C, each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
5) Specified RthJA value is according to JEDEC JESD51-2, -3 at natural convection on FR4 2s2p board; The product (chip
+ package) was simulated on a 76.2 x 114.3 x 1.5mm board with two inner copper layers ( 4 x 35µm Cu). Ta = -40°C,
each channel dissipates 0.2W. Ta = 85°C, each channel dissipates 0.135W.
Data Sheet
12
1.0
2016-09-08
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