MC7457RX1267LC Datasheet, PDF (60/71 Pages) Freescale Semiconductor, Inc – Microprocessor

System Design Information
9.8 Thermal Management Information
This section provides thermal management information for the ceramic ball grid array (CBGA) package
for air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 27); however, due to the potential large
mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used,
the spring force should not exceed 10 pounds.
Heat Sink
CBGA Package
Heat Sink
Clip
Thermal
Interface Material
Printed-Circuit Board
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
The board designer can choose between several types of heat sinks to place on the MPC7457. There are
several commercially available heat sinks for the MPC7457 provided by the following vendors:
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
603-224-9988
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
408-749-7601
Calgreg Thermal Solutions
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
401-732-8100
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
818-842-7277
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
60
Freescale Semiconductor