MC7457RX1267LC Datasheet, PDF (11/71 Pages) Freescale Semiconductor, Inc – Microprocessor

General Parameters
Table 1. Microarchitecture Comparison (continued)
Microarchitectural Specs
MPC7457/MPC7447
MPC7455/MPC7445
MPC7450/MPC7451/
MPC7441
Cache level
Total SRAM space supported
L3
1 MB, 2MB, 4 MB ²
L3
1 MB, 2 MB
L3
1 MB, 2 MB
On-chip tag logical size (cache space)
1 MB, 2 MB
1 MB, 2 MB
1 MB, 2 MB
Associativity
8-way
8-way
8-way
Number of 32-byte sectors/line
2, 4
2, 4
2, 4
Off-Chip data SRAM support
MSUG2 DDR, LW, PB2 MSUG2 DDR, LW, PB2 MSUG2 DDR, LW, PB2
Data path width
64
64
64
Direct mapped SRAM sizes
1 MB, 2 MB, 4 MB
1 MB, 2 MB
1 MB, 2 MB
Parity
Byte
Byte
Byte
Notes:
1. Not implemented on MPC7447, MPC7445, or MPC7441.
2. The MPC7457 supports up to 4 MB of SRAM, of which a maximum of 2 MB can be configured as cache memory; the
remaining 2 MB may be unused or configured as private memory.
4 General Parameters
The following list provides a summary of the general parameters of the MPC7457:
Technology
0.13 μm CMOS, nine-layer metal
Die size
9.1 mm × 10.8 mm
Transistor count
58 million
Logic design
Fully-static
Packages
MPC7447: Surface mount 360 ceramic ball grid array (CBGA)
MPC7457: Surface mount 483 ceramic ball grid array (CBGA)
Core power supply 1.3 V ±50 mV DC nominal
I/O power supply
1.8 V ±5% DC, or
2.5 V ±5% DC, or
1.5 V ±5% DC (L3 interface only, not implemented on MPC7447)
5 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC7457.
5.1 DC Electrical Characteristics
The tables in this section describe the MPC7457 DC electrical characteristics.Table 2 provides the
absolute maximum ratings.
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
Freescale Semiconductor
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