MC7457RX1267LC Datasheet, PDF (48/71 Pages) Freescale Semiconductor, Inc – Microprocessor

Package Description
8.5 Mechanical Dimensions for the MPC7457, 483 CBGA or
RoHS BGA
Figure 22 provides the mechanical dimensions and bottom surface nomenclature for the MPC7457, 483
CBGA package.
A1 CORNER
E3
E
E2
E1
D
D3
D1
D2
2X
0.2
B
E4
Capacitor Region
0.15 A
NOTES:
1. DIMENSIONING AND
TOLERANCING
A PER ASME Y14.5M, 1994.
2. DIMENSIONS IN
MILLIMETERS.
3. TOP SIDE A1 CORNER
INDEX IS A METALIZED
FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE.
A1 CORNER IS
DESIGNATED WITH A BALL
MISSING FROM THE
ARRAY.
Millimeters
2X
0.2
C
e
D4
1 2 3 4 5 6 7 8 9 10 111213141516 171819 2021 22
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
A
0.35 A
A3
A2
A1
483X b
0.3 A B C
0.15 A
DIM
A
A1
A2
A3
b
D
D1
D2
D3
D4
e
E
E1
E2
E3
E4
MIN MAX
2.72 3.20
0.80 1.00
1.10 1.30
--
0.60
0.82 0.93
29.00 BSC
— 12.5
8.5
—
—
8.4
10.9 11.1
1.27 BSC
29.00 BSC
— 12.5
8.5
—
—
8.4
9.55 9.75
Figure 22. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7457,
483 CBGA or RoHS BGA Package
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
48
Freescale Semiconductor