MC7457RX1267LC Datasheet, PDF (14/71 Pages) Freescale Semiconductor, Inc – Microprocessor

Electrical and Thermal Characteristics
Table 4 provides the recommended operating conditions for the MPC7457.
Table 4. Recommended Operating Conditions ¹
Characteristic
Symbol
Recommended Value
Min
Max
Unit Notes
Core supply voltage
V_DD
1.3 V ± 50 mV
V
PLL supply voltage
AV_DD
1.3 V ± 50 mV
V
2
Processor bus supply voltage
BVSEL = 0
OV_DD
1.8 V ± 5%
V
BVSEL = HRESET or OV_DD
OV_DD
2.5 V ± 5%
V
L3 bus supply voltage
L3VSEL = 0
GV_DD
1.8 V ± 5%
V
L3VSEL = HRESET or GV_DD
GV_DD
2.5 V ± 5%
V
L3VSEL = ¬HRESET
GV_DD
1.5 V ± 5%
V
3
Input voltage
Processor bus
V_in
GND
OV_DD
V
L3 bus
V_in
GND
GV_DD
V
JTAG signals
V_in
GND
OV_DD
V
Die-junction temperature
T_j
0
105
°C
Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not
guaranteed.
2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the voltage
at the AV_DD pin, which may be reduced from V_DD by the filter.
3. ¬HRESET is the inverse of HRESET.
Table 5 provides the package thermal characteristics for the MPC7457.
Table 5. Package Thermal Characteristics ¹
Characteristic
Junction-to-ambient thermal resistance, natural convection
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
Junction-to-ambient thermal resistance, 200 ft/min airflow,
single-layer (1s) board
Junction-to-ambient thermal resistance, 200 ft/min airflow,
four-layer (2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
Symbol
R_θJA
R_θJMA
R_θJMA
R_θJMA
R_θJB
R_θJC
Value
MPC7447
22
14
MPC7457
20
14
16
15
11
11
6
6
<0.1
<0.1
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Notes
2, 3
2, 4
2, 4
2, 4
5
6
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
14
Freescale Semiconductor