MC7457RX1267LC Datasheet, PDF (44/71 Pages) Freescale Semiconductor, Inc – Microprocessor

Package Description
8 Package Description
The following sections provide the package parameters and mechanical dimensions for the CBGA
package.
8.1 Package Parameters for the MPC7447, 360 CBGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
ceramic ball grid array (CBGA).
Package outline
25 × 25 mm
Interconnects
360 (19 × 19 ball array – 1)
Pitch
1.27 mm (50 mil)
Minimum module height 2.72 mm
Maximum module height3.24 mm
Ball diameter
0.89 mm (35 mil)
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8
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Freescale Semiconductor